{"product_id":"2uul-bg02-universal-reballing-stencil","title":"2UUL BG02 UNIVERSAL REBALLING STENCIL","description":"\u003cp\u003eThe 2UUL BG02 is a premium-grade universal reballing stencil engineered for the high-precision demands of modern GSM repair. Featuring a vast array of high-accuracy square and round holes, it supports a wide spectrum of smartphone ICs, including power management (PMIC), audio codecs, and charging chips. Crafted from high-quality Japanese steel with a specialized 0.12mm thickness, the BG02 ensures perfect solder ball formation while resisting thermal deformation during high-heat BGA rework\u003c\/p\u003e","brand":"GSMboss.Shop","offers":[{"title":"Default Title","offer_id":46379514495033,"sku":null,"price":160.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0801\/1621\/9961\/files\/BG02_AB_4_470x_6cc0390f-b34a-4f17-a6fe-959b2b8b5c43.webp?v=1787351649","url":"https:\/\/gsmboss.shop\/products\/2uul-bg02-universal-reballing-stencil","provider":"GSMboss.Shop","version":"1.0","type":"link"}