2UUL SC88 IC MICRO POINT PRY NEEDLE

Surgical Precision for Advanced Logic Board Repair

The 2UUL SC88 is designed to act as a high-precision extension of the technician’s fingers. When performing complex IC swaps or underfill cleaning, standard tools often lack the tactile feedback and slim profile needed. The SC88 solves this by combining aerospace-grade materials with microscopic tool tips.

Key Features:

Ultralight Carbon Fiber Handle: Crafted from 2UUL’s signature DA29 “Vajra Carbon,” the handle is extremely durable yet incredibly lightweight (approx. 22g). This reduces hand fatigue and tremors during long hours of microscopic work.

Precision Micro-Point Needles: Includes two high-elasticity steel needles designed to embed safely under IC edges. These tips are rigid enough to lift components but flexible enough to prevent pad tearing.

High-Heat Resistance: The metal tips are engineered to withstand the direct airflow of hot air rework stations. This allows you to gently pry up an IC or remove a metal shield at the exact moment the solder reaches its liquidus state.

Non-Magnetic Design: The assembly is naturally non-magnetic, ensuring that tiny SMD components, screws, and inductors do not stick to the tool during placement.

Tactile Point Control: The slim, balanced body offers superior “tin drag” control and allows for precise scraping of via coatings and corner underfill without damaging the solder mask.

Versatile Applications:

IC Disassembly: Lifting BGA, PMIC, and NAND chips.

Underfill Cleaning: Removing black glue and epoxy residue.

Jumper Wire Routing: Precisely guiding 0.01mm wires under a microscope.

SMD Manipulation: Adjusting 01005 components that are too small for tweezers.

Technical Specifications:

Brand: 2UUL

Model: SC88 (Micro-Point Series)

Handle Material: High-Strength Carbon Fiber (DA29)

Tip Material: Hardened Precision Steel (Pointed)

Total Weight: 0.022 kg (approx. 22g)

Package Includes: 1x Carbon Fiber Handle, 2x Micro-Point Needles.

Application: BGA Repair, IC Glue Removal, Tin Dragging, Mobile Diagnostics.