RF4 RF-FTH Universal Integrated Circuit (IC) Solder Implantation Fixture

RF4 RF-FTH Universal Integrated Circuit (IC) Solder Implantation Fixture

R 330.00
Sale price  R 330.00 Regular price 
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RF4 RF-FTH Universal Integrated Circuit (IC) Solder Implantation Fixture

RF4 RF-FTH Universal Integrated Circuit (IC) Solder Implantation Fixture

R 330.00
Sale price  R 330.00 Regular price 

Precision Engineering for Micro-Solder Implantation

The RF4 RF-FTH is built for technicians who demand surgical accuracy during the reballing process. By combining a robust chip-holding mechanism with a heat-stabilized work surface, it eliminates the “chip-drifting” issues common with inferior fixtures.


Key Features:

Universal IC Compatibility: The adjustable sliding tension arms are designed to securely hold various IC sizes, from small power management chips to large CPU and NAND Flash processors.


Specialized Solder Implantation Surface: The fixture features a recessed area optimized for solder paste application and stencil alignment, ensuring perfectly uniform solder balls across the BGA grid.


Industrial Heat Resistance: Constructed from high-density synthetic stone and premium alloys, the RF-FTH can withstand direct exposure to hot air stations ($500°\text{C}+$) without warping or transferring excessive heat to your workbench.


One-Handed Operation: The ergonomic spring-loaded clamping system allows for rapid chip swaps, increasing efficiency during high-volume motherboard swaps or data recovery tasks.


Weighted Anti-Slip Foundation: Its heavy-duty metal base ensures the fixture remains stationary under the microscope, even when you are scraping off tough underfill glue or old solder.


Protective Clamping Jaws: The contact points are precision-milled to provide a firm grip without damaging the sensitive edges or corners of delicate silicon wafers.


Technical Specifications:

Brand: RF4 (Repair Friend)


Model: RF-FTH


Material: Anodized Aluminum + High-Temperature Synthetic Stone


Function: IC Reballing, Solder Implantation, Chip Cleaning, Glue Removal


Compatibility: iPhone, Android, and general SMD/BGA components


Design: Low-profile for comfortable microscope usage

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