2UUL BG02 UNIVERSAL REBALLING STENCIL

The 2UUL BG02 is a premium-grade universal reballing stencil engineered for the high-precision demands of modern GSM repair. Featuring a vast array of high-accuracy square and round holes, it supports a wide spectrum of smartphone ICs, including power management (PMIC), audio codecs, and charging chips. Crafted from high-quality Japanese steel with a specialized 0.12mm thickness, the BG02 ensures perfect solder ball formation while resisting thermal deformation during high-heat BGA rework