2UUL PB02 PadBall Solder Balls for Android(100000 BALLS)

The 2UUL PB02 PadBall is a high-volume, professional-grade set of 100,000 lead-free BGA solder balls, specifically optimized for Android smartphone IC repair. These precision-engineered spheres offer exceptional sphericity and size uniformity, making them the industry standard for reballing Qualcomm, MediaTek, and Exynos CPUs. With a high-purity composition and excellent thermal conductivity, the PB02 series ensures long-lasting, reliable connections for Android logic boards, from flagship Samsung and Xiaomi devices to global Android brands.