RF FT3X Precision Dual-Axis Motherboard Fixture

Ultimate Stability for High-Density Logic Board Repair

In modern smartphone repair, even a millimeter of movement can ruin a delicate trace or misalign a BGA chip. The RF FT3X Fixture is built to eliminate movement entirely, providing a rock-solid foundation for work under the microscope.

Key Features:

Independent Dual-Axis Clamping: Unlike single-rail holders, the FT3X features two independently adjustable clamping zones. This allows you to secure a motherboard on one side while simultaneously holding a separate IC chip for glue removal on the other.

Elite Heat-Resistant Synthetic Stone: The clamping jaws are lined with premium, anti-static synthetic stone that withstands direct heat from hot air guns ($500°\text{C}+$). It provides excellent thermal insulation, protecting your workbench and preventing the fixture from becoming too hot to touch.

Universal Multi-Point Grip: The specialized “sawtooth” and “groove” design of the jaws ensures a non-slip grip on oddly shaped PCBs, including the L-shaped motherboards found in modern iPhones and flagship Android devices.

Dedicated IC Repair Slots: Integrated precision-milled areas are specifically designed to hold CPUs, Power ICs, and Nand chips securely, making the “cleaning and scraping” of underfill glue safer and faster.

Industrial Heavyweight Base: Constructed with a solid stainless steel chassis and high-friction silicone feet. The added weight prevents the fixture from sliding or tipping during high-pressure scraping or desoldering.

Precision Spiral Drive: High-quality threaded rods ensure smooth, micro-adjustable tension, giving you total control over the clamping pressure to prevent PCB warping.

Technical Specifications:

Brand: RF (Repair Friend)

Model: FT3X

Material: Stainless Steel + High-Density Synthetic Stone

Clamping Type: Dual-Axis Independent

Compatibility: Universal (iPhone, Samsung, Huawei, Xiaomi, iPad, etc.)

Application: BGA Reballing, Motherboard Soldering, IC Glue Removal, FaceID Repair.